Our company developed non-contacting temperature sensor of world-smallest class, which package is surface mountable and its size is 2.2mm long & wide with 0.9mm thick. This sensor features unaffectedness by environmental temperature.

Since this device is small and surface mountable, applications such as smartphone, wearable device are the most suitable.

Conventional type, thermopile method, which detects difference of temperature between cold junction and hot junction in the device element, has issues such that surface mounting is difficult and customer's mounting environment (environmental temperature) has constraint, due to complicated structure considering package's thermal conductivity.

SFB sensor (Smart Functional Bolometer sensor) (Trademark pending) developed this time, has structure of super low heat capacity in sensing part by our micro electro-mechanical system (MEMS) technology, and uses vacuum-sealing technology and functional thin-film technology in silicon wafer level which was newly self-developed. Furthermore, two sensor parts, sensing and reference, are formed within the same chip, and uses the method to output those difference.

These new technologies realized strong against change of environmental temperature, and surface-mountable type