HDK in a Minute
HDK: What kind of company is it?
HDK Products
Mobility
Information & Communications
Industrial, Healthcare, and Home Appliances
Electronic Components Devices (Resistors, etc.)
Arc Resistance
Chip Fuse
Surge resistance High power
Chip Resistor
Ultra-small (0402, 0603)
Resistors
Chip
Fuses
Chip Resistor
Tactile
Switch
Electronic Component Devices (Sensors, etc.)
Automotive Sensors
Humidity Sensor
Piezoelectric Buzzers
Force Sensor
Humidity Sensor
Thermistor
Pressure/Water Level Sensor
Module
Automotive Mounting Modules
Position Detection Module
Wireless Module
Wireless Unit
Mounting Module
HDK’s Strengths
＝ Providing solution products through
the integration of core technologies
■Core Technology Evolution
Contributing to reduced environmental impact through technological innovations enabling smaller products, higher power capabilities, and ultra-high-density mounting techniques
■Recognition of
Social Issues
Decarbonized Society
Effective Resource Utilization
Declining Labor Force
Widespread Adoption of Safe and Secure Products
■New Product Creation
Proposing Total Solutions for a Connected/Supportive Society
Product development for decarbonization, electrification, and digital transformation
■Delivering
Value
Providing high precision, high quality components to enhance safety and security functions for the transition to electric vehicles
Expansion into Three Core Businesses
HDK in Numbers（FY2024）
Net sales
¥43.2billion
(5 manufacturing, 6 sales)
(5 manufacturing, 5 sales)
Considering “stable supply, local production for local consumption, and sustainable business development,” we are strengthening our production system in the ASEAN region while maintaining the current structure for production in China.
Number of Employees
639
(Consolidated employees: 1,801)
Male
71％
Female
29％
Ayumi and the Future
- 1940
- 1960
- 1980
- 1990
- 2000
- 2010
- 2020
1943~
Founded
1940
1943~
Founded
・Fixed Carbon Film Resistor
〈Scenes of Toyama City and Products at the Time of Founding〉
1966~
Period of
Development and
Transformation
1960
1966~
Period of
Development and
Transformation
- ●1960–
- ・Printed resistor substrates
- ・Silver Paste
Through-Hole Substrates - ・Thick Film hybrid integrated circuits
- ・Variable Resistor
- ・High-voltage resistive circuits
1981~
Leap Period
1980
1981~
Leap Period
- ●Restructuring Period
- ・Thick Film Chip Resistors
- ・Resistive Humidity Sensors
- ・Piezoelectric products
- ・Mounting Module Products
- ・Tactile switches
1991~
Restructuring Period
1990
1991~
Restructuring Period
- ●1990–
- ・Pressure Sensor
- ・Copper paste
through-hole substrate - ・Metal Plate Resistor
2001~
Toward a Second Founding
2000
2001~
Toward a Second Founding
- ●2000年～
- ・Force Sensor
- ・3-axis Accelerometer
- ・Wireless Module
2001~
Toward a Second Founding
2010
- ●2010–
- ・Capacitive Humidity Sensor
- ・Water level sensor
- ・Thermistor
- ・Barometric pressure sensor
2001~
Toward a Second Founding
2020年
- ●2020–
- ・IoT Module
- ・Wireless Units