1943

April

Hokuriku Electric Science Industries Co., Ltd. established in Osawanomachi, Toyama Prefecture (present-day Toyama City) with capital of ¥150,000

1961

December

Established Hokuriku Seiki Co., Ltd. (currently a consolidated subsidiary)

1969

July

Established North Japan Electronics Co., Ltd.

1979

November

Established Hokuriku Singapore Co., Ltd. (currently a consolidated subsidiary) in Singapore

1982

Formed a capital alliance with Oizumi Manufacturing Co., Ltd., and began selling non-linear devices (such as sensors)

April

Established Hokuriku IC Co., Ltd. (currently a consolidated subsidiary) and Kurose Electronics Co., Ltd. (currently a consolidated subsidiary, Asahi Electronics Co., Ltd.)

1984

April

Issued new shares through a public offering (4,000,000 shares issued, total payment received: ¥4,992 million).

1986

September

Listed on the First Section of the Tokyo Stock Exchange

October

Established Taiwan Hokuriku Electronics Co., Ltd. in the Republic of China

1987

September

Formed a capital alliance with Daiwa Circuit Module Co., Ltd. (currently a consolidated subsidiary)

1990

February

Formed a capital alliance with Lexican Circuit Corporation of Canada

1994

July

• Established Hokuden Malaysia Sdn. Bhd. (currently a consolidated subsidiary) in Malaysia
• Formed a capital alliance with Koyo Precision Co., Ltd. and began selling crystal-related products through our company

1995

February

Established Suzhou Daiwa Precision Mold Co., Ltd. in the People’s Republic of China

1996

September

Established HDK America, Inc. (currently a consolidated subsidiary) in the United States

1997

February

Established HDK China Co., Ltd. (currently a consolidated subsidiary) in Hong Kong

March

Established Hokuriku Asia Holdings Co., Ltd. in Singapore

2001

March

• Hokuriku Electronics Co., Ltd. transfers its manufacturing and sales divisions to Hokuriku Flotlist Co., Ltd.
• Issued new shares through a third-party allotment (5,553,000 shares issued, total issue price: ¥1,082 million)

2002

October

Established Hokuriku (Shanghai) International Trading Co., Ltd. (currently a consolidated subsidiary) in the People’s Republic of China

December

• Announced measures for completing financial restructuring under the “HDK Revitalization Program” and resuming dividends as soon as possible
• Transferred shares of Koyo Precision Co., Ltd. held by the Company

2003

January

Transfer of shares held by the Company in Oizumi Manufacturing Co., Ltd.

February

• Hokuriku Kosan Co., Ltd. and Kita Nippon Electronics Co., Ltd. merged, with Hokuriku Kosan Co., Ltd. (currently a consolidated subsidiary) as the surviving company
• Lexican Circuits Inc. of Canada files for bankruptcy with the Ontario Bankruptcy Court in Canada

August

The formal capital reduction (resolved at the 69th Ordinary General Meeting of Shareholders) took effect, reducing capital by ¥9,669 million to ¥3,000 million

October

First unsecured corporate bond issuance (total issuance amount: ¥2 billion; repayment method: lump-sum repayment due October 17, 2008).

2004

September

• Transferred shares of Hokuriku Malaysia Sdn. Bhd. held by the Company
• Established Tianjin Hokuriku Electric Co., Ltd. (currently a consolidated subsidiary) in the People’s Republic of China

December

Announced measures to transform into a value-creating company under the Medium-term Management Plan “V-PLAN 07”

2005

October

Issued the second unsecured corporate bond (total issuance amount: ¥1 billion; repayment method: lump-sum repayment due October 30, 2009)

2006

March

• New share issuance through public offering (Number of shares issued: 8,000,000 shares; Total issue price: ¥2,373 million)
• Third-party allotment of new shares (Number of shares issued: 800 thousand shares, Total issue price: ¥237 million)

2007

October

Established HDK Thailand Co., Ltd. (currently a consolidated subsidiary, a manufacturing subsidiary for Module Products) in Thailand

2008

February

Announced various measures to pursue renewed growth under the Medium-term Management Plan “G-PLAN 10”

March

Hokuriku Asia Holdings Co., Ltd. dissolved and liquidation completed

October

First unsecured corporate bond matures and is repaid in full (redemption amount: ¥2 billion)

2009

September

Announcement of capital and business alliance with Sumitomo Metal Microdevices, Inc. in the Module Products field

October

Second Unsecured Corporate Bond Maturity Lump-Sum Redemption (Redemption Amount: ¥1 billion)

2010

August

• Acquired shares of Sumitomo Metal Microdevices Co., Ltd. (changed its trade name to HDK Microdevices Co., Ltd. (currently a consolidated subsidiary) on August 2, 2010), making it a subsidiary. Simultaneously, the Company’s electronic module business was transferred to HDK Microdevices Co., Ltd. through an absorption-type split (reverse acquisition). As a result, Shanghai Hokuriku Microelectronics Co., Ltd. (currently a consolidated subsidiary) in the People’s Republic of China and HDK Philippines, Inc. in the Philippines became subsidiaries.
• Taiwan Hokuriku Electronics Co., Ltd. dissolved in March 2008 and completed liquidation.

2011

October

Established Hokuriku Electric (Guangdong) Co., Ltd. (currently a consolidated subsidiary) in the People’s Republic of China.

November

Established Hokuriku International Thailand Co., Ltd. (currently a consolidated subsidiary) in Thailand.

2017

June

Transferred shares of HDK Philippines Corporation held by HDK Microdevices Corporation

2018

October

Acquired shares of Nomura Engineering Co., Ltd. (currently a consolidated subsidiary) and made it a subsidiary.

2022

April

Transitioned from the First Section of the Tokyo Stock Exchange to the Prime Market following a market classification review by the Tokyo Stock Exchange.