Module Products｜Electronic Circuit Function Module
A wide range of equipment supporting diverse product lines
We possess diverse equipment capable of handling not only general chip component mounting but also the manufacturing of specialized products.
1. Mounting Equipment
In addition to Japan (Toyama), we have manufacturing bases in China (Shanghai) and Thailand, establishing a global production system.
Our Toyama facility is equipped to handle both prototyping and flexible mass production.
We provide high-quality mounting services globally for a wide range of fields, including Automotive Equipment, mobile devices, Consumer Equipment, and Industrial Equipment.
2. BGA Rework Equipment
This rework equipment is specifically designed for BGA packages, which are difficult to rework manually.
3. Conformal Coating Equipment
This conformal coating equipment automatically applies moisture-proof coating to circuit boards.
Our original jigs, designed and manufactured in-house, enable mass production while meeting the requirement for narrow proximity between coating areas and non-coating areas.
Using a moisture-proof coating containing a fluorescent agent enables automatic inspection via an Automatic Optical Inspection (AOI) system.
4. Wave Soldering Equipment
This is an automatic soldering device used for mounting lead components.
It employs a jet-type solder bath and is compatible with nitrogen (N₂) atmospheres.
This device automates the entire process from removing components from in-process trays, performing electrical characteristics inspection, to storing them in shipping trays.
We designed and manufactured the entire system, including material handling (MTH), in-house to achieve automation of the inspection process.
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