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Lead solder (Sn-Pb) has been used for connection of printed circuit board and electronic components for many years. The lead in the solder used for the discarded printed circuit board flows in the earth by acid rain in recent years, and the influence on the human body by groundwater being polluted by the lead is posing a problem.
By WEEE(*1) &RoHS (*2) Directive of EU, lead use is forbidden on and after July 1, 2006. Moreover, lead-free requirements which are led by green procurement etc. also are becoming even stronger from our customers
(*1) WEEE: Waste Electrical and Electronic Equipment.
(*2) RoHS: The restriction of the certain hazardous substances in electrical and electronic equipment.
Our company is also taking the measures for lead-free in whole company.
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Classification (*3) |
Contents |
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Phase 2 |
Terminal platings/electrodes to the boards for electronic components, etc are being lead-free. |
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Phase 3A |
Except for what is granted to be excluded by RoHS, everything including internal connection, and composition parts and material instructions are lead-free. |
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Phase 3 |
Everything including internal connection, and composition parts and materials are lead-free. Abolition of lead for connection inside product Abolition of lead in the glass of electronic parts Abolition of lead in electronic ceramic parts |
(*3) Phase 2, Phase 3A, and Phase 3 are the phase classification of lead-free by JEITA (Japan Electronics and Information Technology Industries Association).
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Classification |
Contents |
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Phase 3A |
By customer’s approval for specification, we are in the process of change one by one. |
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Phase 3 |
Some of products have already been implemented and in the process of change one by one. We are going to make implementation further, to aim at lead-free of all products. |
